Rise of Advanced Packaging: Chiplets Become Industry Hotspot

Chiplet Technology

AMD, Intel, NVIDIA, and other vendors are driving Chiplet technology forward. The UCIe alliance now includes over 100 members, with the ecosystem steadily maturing.

3D Packaging

Mass production of 3D packaging technologies such as TSMC's SoIC, Intel's Foveros, and Samsung's X-Cube delivers significant performance gains.

Domestic Progress

Domestic OSATs such as JCET, Tongfu Microelectronics, and Huatian Technology are actively advancing their advanced packaging capabilities, narrowing the technology gap.